
ESD Resin
Semiconductor industry solution for smaller, high precision parts
Colors: Black
Best cleanroom option for ESD-safe applications. Visually impressive prototypes for protection of sensitive electronics. Intended for use in semiconductor and similar manufacturing environments to prevent ESD damage. Each part printed from ESD SAFE resin is tested post-printing to ensure compliance with industry standard 10^-6 to 10^-11 ohm resistivity requirements.
Pros: ESD-Safe!, Excellent visual appearance, printing precision of up to 50um layers thickness, Good durability and surface wear resistance, no layer lines, functional solution for parts with design considerations.
Cons: Higher cost compared with FDM, limited temperature resistances, not intended for UV exposure.

SPECS:
Tensile Strength: 44.2Mpa
Modulus of Elasticity: 1.937GPa
Temperature Resistance: 62.2degC
Suggested Layer Height: 100um
Minimum Layer Height: 50um
Additional Features: None